Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)

Published by	Publication Date	Number of Pages
IEC	06/11/2003	32

Category: IEC

Description

IEC 60191-6-4 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.