GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

Published by	Publication Date	Number of Pages
JEDEC	01/01/2008	34

Category: JEDEC

Description

JEDEC JEP154 – GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS

This document describes a method to test the electromigration (EM) susceptibility of solder bumps, including other types of bumps, such as solder capped copper pillars, used in flip-chip packages. The method is valid for Sn/Pb eutectic, high Pb, and Pb-free solder bumps. The document discusses the advantages and concerns associated with EM testing, as well as options for data analysis.