ASTM F3166

ASTM F3166

$29.00

Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization

Published by Publication Date Number of Pages
ASTM 05/01/2016 5
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Description

ASTM F3166 – Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization

1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.

Product Details

Published:
05/01/2016
Number of Pages:
5
File Size:
1 file , 110 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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