ASTM F3147 – Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
Product Details
Published:
06/01/2015
Number of Pages:
3
File Size:
1 file , 130 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
