BS 3934-5 – Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
Product Details
Published:
09/15/1997
ISBN(s):
0580278123
Number of Pages:
38
File Size:
1 file , 940 KB
Product Code(s):
01094344, 01094344, 01094344
Note:
This product is unavailable in Ukraine, Russia, Belarus
