BS PD IEC TR 61189-5-506 – Test methods for electrical materials, printed boards and other interconnection structures and assemblies
This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.
