IEC 60191-6-4 Ed. 1.0 en:2003

IEC 60191-6-4 Ed. 1.0 en:2003

$55.00

Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
standard by International Electrotechnical Commission, 06/11/2003

Preview
PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

Description

Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Product Details

Edition:
1.0
Published:
06/11/2003
Number of Pages:
16
File Size:
1 file , 500 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus

In Demand Now