IEC 60749-19 Amd.1 Ed. 1.0 b:2010

IEC 60749-19 Amd.1 Ed. 1.0 b:2010

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Amendment 1 – Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength
Amendment by International Electrotechnical Commission, 07/28/2010

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Product Details

Edition:
1.0
Published:
07/28/2010
Number of Pages:
4
File Size:
1 file , 280 KB
Note:
This product is unavailable in Ukraine, Russia, Belarus

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