IEC 60749-19 Ed. 1.0 b

Description

IEC 60749-19 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 19: Die shear strength

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

Product Details

Edition:

1.0

Published:

02/13/2003

Number of Pages:

11

File Size:

1 file , 200 KB

Note:

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