IPC 2222

Description

Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single, double or multi-layered boards. Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters. This document should be used in conjunction with IPC- 2221.

Product Details

Published:

03/01/1998

Number of Pages:

24

File Size:

1 file , 900 KB

Product Code(s):

2222(D)1

Note:

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