IPC 7525B

Description

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

Product Details

Published:

10/01/2011

Number of Pages:

36

File Size:

1 file , 2.1 MB

Note:

This product is unavailable in Russia, Ukraine, Belarus