JEDEC JEP158

JEDEC JEP158

$37.00

3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions

Published by Publication Date Number of Pages
JEDEC 11/01/2009 23
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Description

JEDEC JEP158 – 3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions

To increase device bandwidth, reduce power and shrink form factor, microelectronics manufacturers are implementing three dimensional (3D) chip stacking using through silicon vias (TSVs). Chip stacking with TSVs combines silicon and packaging technologies. As a result, these new structures have unique reliability requirements. This document is a guideline that describes how to evaluate the reliability of 3D TSV silicon assemblies.

Product Details

Published:
11/01/2009
Number of Pages:
23
File Size:
1 file , 170 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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