JEDEC JEP167A

JEDEC JEP167A

$43.00

Characterization of Interfacial Adhesion in Semiconductor Packages

Published by Publication Date Number of Pages
JEDEC 11/01/2020 32
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JEDEC JEP167A – Characterization of Interfacial Adhesion in Semiconductor Packages

This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.

Product Details

Published:
11/01/2020
Number of Pages:
32
File Size:
1 file , 390 KB
Redline File Size:
2 files , 3.8 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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