JEDEC JESD 22-A121A (R2014)

JEDEC JESD 22-A121A (R2014)

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MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES

Published by Publication Date Number of Pages
JEDEC 07/01/2008 31
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Description

JEDEC JESD 22-A121A (R2014) – MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES

The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.

Product Details

Published:
07/01/2008
Number of Pages:
31
File Size:
1 file , 930 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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