JEDEC JESD 22-B115
$37.00
SOLDER BALL PULL
standard by JEDEC Solid State Technology Association, 05/01/2007
Description
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document.
Product Details
- Published:
- 05/01/2007
- Number of Pages:
- 22
- File Size:
- 1 file , 130 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus