This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs (surface mount devices) that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow).
Product Details
Published:
11/01/2016
Number of Pages:
18
File Size:
1 file , 65 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus
