JEDEC JESD22-B106D
$32.00
RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
standard by JEDEC Solid State Technology Association, 04/01/2008
Description
This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.
Product Details
- Published:
- 04/01/2008
- Number of Pages:
- 12
- File Size:
- 1 file , 70 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus