JEDEC JESD51-11

JEDEC JESD51-11

$35.00

TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT

Published by Publication Date Number of Pages
JEDEC 06/01/2001 17
PDF FormatPDF FormatMulti-User-AccessMulti-User AccessPrintablePrintableOnline downloadOnline Download
Category:

Description

JEDEC JESD51-11 – TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Pin Grid Array (PGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-11 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

Product Details

Published:
06/01/2001
Number of Pages:
17
File Size:
1 file , 210 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

In Demand Now