JEDEC JESD59

Description

JEDEC JESD59 – BOND WIRE MODELING STANDARD

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

Product Details

Published:

06/01/1997

Number of Pages:

16

File Size:

1 file , 260 KB

Note:

This product is unavailable in Russia, Ukraine, Belarus