JEDEC JS 9703 – IPC/JEDEC-9703: Mechanical Shock Test Guidelines for Solder Joint Reliability
This document establishes mechanical shock test guidelines for assessing solder joint reliability of Printed Circuit Board (PCB) assemblies from system to component level.
Product Details
Published:
03/01/2009
Number of Pages:
46
File Size:
1 file , 3.7 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
