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Environmental testing — Part 2: Tests — Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2002
JIS C 60068-2-58 – Environmental testing — Part 2: Tests — Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Product Details
Published:
01/01/2002
File Size:
1 file , 1.7 MB
Note:
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