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Base materials for printed circuits — Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/1999
JIS C 6494 – Base materials for printed circuits — Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Product Details
Published:
01/01/1999
File Size:
1 file , 670 KB
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