IPC 9301

Description

IPC 9301 – Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.

Product Details

Published:

12/01/2018

ISBN(s):

9781611934342

Number of Pages:

92

File Size:

1 file , 7.4 MB

Note:

This product is unavailable in Russia, Belarus