IPC 9502 – PWB Assembly Soldering Process Guideline for Electronic Components
This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.
Product Details
Published:
04/01/1999
Number of Pages:
12
File Size:
1 file , 210 KB
Part of:
IPC M109, IPC 9500-K
Product Code(s):
9502(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
