IPC 9707

IPC 9707

$89.00

Spherical Bend Test Method for Characterization of Board Level Interconnects

Published by Publication Date Number of Pages
IPC 09/01/2011 24
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IPC 9707 – Spherical Bend Test Method for Characterization of Board Level Interconnects

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component’s board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.

Product Details

Published:
09/01/2011
Number of Pages:
24
File Size:
1 file , 2.4 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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