IPC D-279

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Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Published by Publication Date Number of Pages
IPC 08/01/1996 146
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IPC D-279 – Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Establishes design concepts, guidelines and procedures for reliable printed wiring assemblies. Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself. Discusses substrates, components, attachment materials, costings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: solder attachments; plated-through via structures; insulation resistance; thermal considerations; environmental stresses; coefficient of thermal expansion; electrostatic discharge; solvents; testability; corrosion aerospace and high altitude concerns.

Product Details

Published:
08/01/1996
Number of Pages:
146
File Size:
1 file , 710 KB
Product Code(s):
D-279(D)1
Note:
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