IPC J-STD-027

IPC J-STD-027

$56.00

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Published by Publication Date Number of Pages
IPC 02/01/2003 20
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Description

IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published:
02/01/2003
Number of Pages:
20
File Size:
1 file , 90 KB
Product Code(s):
J-027(D)1, J-027(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus

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