IPC SM-784

Description

IPC SM-784 – Guidelines for Chip-on-Board Technology Implementation

Discusses chip types, board selection, design issues and thermal transfer methods for Chip on Board (COB) applications. Details wire bonding, TAB and flip chip designs and provides information on mounting materials, including adhesives, wires and various mechanical bonding techniques.

Product Details

Published:

11/01/1990

Number of Pages:

37

File Size:

1 file , 440 KB

Product Code(s):

SM-784(D)1

Note:

This product is unavailable in Russia, Ukraine, Belarus