IPC SM-839 – Pre and Post Solder Mask Application Cleaning Guidelines
Covers all aspects of cleaning related to solder mask application, including board preparation, in-process control and maintenance of cleanliness during pre-assembly processes.
Product Details
Published:
04/01/1990
Number of Pages:
29
File Size:
1 file , 130 KB
Product Code(s):
SM-839(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus
