IPC SMC-TR-001 – An Introduction to Tape Automated Bonding Fine Pitch Technology
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.
Product Details
Published:
01/01/1989
Number of Pages:
54
File Size:
1 file , 1.4 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
