IPC TR-486

IPC TR-486

$79.00

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Published by Publication Date Number of Pages
IPC 07/01/2001 56
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Description

IPC TR-486 – Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

This technical report provides full detail of the round robin study charged with assessing the use of Interconnect Stress Test (IST) as a test for incoming inspection in lieu of Thermal Stress in the detection of innerlayer separations in plated-through holes. Includes background on the Post Separation Task Group, test results, round robin test plan, conclusions and test methods used.

Product Details

Published:
07/01/2001
Number of Pages:
56
File Size:
1 file , 760 KB
Product Code(s):
TR-486(D)1, TR-486(D)1
Note:
This product is unavailable in Russia, Ukraine, Belarus

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